A Coupled Thermoreflectance Thermography Experimental System and Ultra-fast Adaptive Computational Engine for the Complete Thermal Characterization of Three-dimensional Electronic Devices: Validation

This work builds on the previous introduction [1] of a coupled experimental-computational system devised to fully characterize the thermal behavior of complex 3D submicron electronic devices. The new system replaces the laser-based surface temperature scanning approach with a CCD camera-based approach. As before, the thermo-reflectance thermography system is used to noninvasively measure with submicron resolution the 2D surface temperature field of an activated device. The measured temperature field is then used as input for an ultra-fast inverse computational solution to fully characterize the thermal behavior of the complex threedimensional device. For the purposes of this investigation, basic micro-heater devices were built, activated, and measured. In order to quantitatively validate the coupled experimental-computational system, the system was used to extract geometric features of a known device, thus assessing the system’s ability to combine measured experimental results and computations to fully characterize complex 3D electronic devices.